π2-Cygni: Modular Sub-Micron Patterning and Photolithographic System
Never before has there been a tool which combines high power, exceptional uniformity, and versatility in an efficient and compact modular form fact - at 172 nm! The revolution begins with the introduction of the π2-Cygni series of vacuum-ultraviolet light processing systems.
All-In-One Construction
Efficient light source, passive cooling, and integrated purge system means that everything needed for operation is contained in the system itself. Just plug in the included 12 Vac power adapter, connect to a purge-gas source with the 1/4" quick-connect fitting, and the π2-Cygni is ready for use.
A Complete and Flexible VUV Exposure System
Using a modular design approach, the π2-Cygni provides capability "right-out-of-the-box" for:
- General purpose large-area VUV flood exposures with integrated inert gas purging
- Basic photoprocess with included exposure chamber and mask holder
- High-resoluton photolithography with included hard-contact photo-mask processing module
- Integration with existing systems using the standardized mounting system
- High-Resolution Photolithography
- Photoablation
- Photolytic/Photocatalytic Processes
- Surface Energy Modification
- Ozone Generation
- Low-Damage Atomic-Level Surface Cleaning
- Enhanced Thin Film Adhesion
Applications
- Next-Generation VUV Light Source: 172 nm
- Best-In-Class Output Intensity
- Exceptional Beam Uniformity: 3% Across Available Aperture
- Long Lamp Life: Up to 30,000 Exposures
- Near-Instantaneous Lamp Turn-On
- Compact, Rugged, and Portable
- Standardized Accessory Mounting Sytem: One Light Source, Many Applications
- Intuitive Design Reduces Training Requirements for All Users
- Environmentally Friendly Operation and Processing
Features
VUV. A New Processing Regime
A New Way to Think of Power
A New Form Factor in Lamp Technology
Ultraviolet is Now Green
Sample/Substrate   Maximum size:   Minimum size:   Maximum mask+sample thickness: |
50 mm × 50 mm (2” × 2”) 10 mm × 10 mm (0.4” × 0.4”) 8 mm |
Mask size | 75 mm × 75 mm (3” × 3”) custom size (optional) |
Sample Alignment   Travel Range         X,Y:         Theta:   Resolution         X,Y:         Theta: |
± 6 mm ± 10° (coarse), ± 3° (Fine) < 1.5 μm (< 0.5 μm optional) 2 × 10-4 ° |
Power requirements   Voltage:   Power consumption: |
12 VDC, 110/220 V AC (12 VDC adapter included) < 20 W |
Utilities Vacuum (optional): Compressed air (optional): |
< -0.2 bar > 1.1 bar |
Exposure mode: | Soft contact, hard contact |
Physical dimensions   Width:   Depth:   Height: |
  205 mm (8”)   230 mm (9”)   400 mm (15.5”) |
Weight: | < 12 kg (26.5 lb) |
Exposure Wavelengths (requires π-Photon, sold separately): |
172 nm, 222 nm, 308 nm |
* Dry nitrogen or Ar purging is required for operation
** UV-grade fused silica transmission spectrum must be verified by manufacturer